ligitek electronics co.,ltd. property of ligitek only ly27490/s15-pf rectangle type led lamps data sheet doc. no : qw0905- rev. : a date : ly27490/s15-pf pb lead-free parts 13 - dec. - 2005
ligitek electronics co.,ltd. property of ligitek only package dimensions note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation part no. l y27490/s15-pf page 1/5 1.4 4.0 6.8 28.0min 0.5 typ 1.0max 1 2 3 - + 1.0min 2-1.27 typ. 2.4 3.55 1.0min y 1 -3 + -30 75% -60 100% 60 25% 25% 50%075% 50%100% 30 0
ligitek electronics co.,ltd. property of ligitek only unit y symbol parameter ratings absolute maximum ratings at ta=25 ma mw 80 60 a 10 i fp pd power dissipation peak forward current duty 1/10@10khz ir reverse current @5v forward current i f ma 20 -40 ~ +100 tstg storage temperature forward voltage @20ma(v) spectral halfwidth nm luminous intensity @ ma(mcd) color part no material typical electrical & optical characteristics (ta=25 ) typ. 180 max. min. min. lens emitted yellow ly27490/s15-pf gaasp/gap note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. peak wave length pnm viewing angle 2 1/2 (deg) operating temperature -40 ~ +85 t opr yellow diffused page 35 5852.6 1.73.07.0 10 2/5 y27490/s15-pf part no. l
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip page 3/5 y27490/s15-pf part no. l
260 c3sec max 5 /sec max 260 120 temp( c) time(sec) 150 50 100 2 /sec max 25 0 preheat 0 page 4/5 ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 60 seconds max y27490/s15-pf part no. l
ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hous. this test intended to see soldering well performed or not. page 5/5 y27490/s15-pf part no. l
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